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レポート概要
| 当調査資料は電子ボードレベルアンダーフィル・カプセル化材料のグローバル市場について調査・分析したレポートです。種類別（フローアンダーフィルなし、キャピラリーアンダーフィル、成形アンダーフィル、ウェーハレベルアンダーフィル）市場規模、用途別（半導体電子機器、航空・航空宇宙、医療機器、その他）市場規模、地域別（北米、米国、カナダ、ヨーロッパ、ドイツ、フランス、イギリス、イタリア、ロシア、アジア、日本、中国、韓国、インド、オーストラリア、台湾、中南米、メキシコ、ブラジル、アルゼンチン、中東・アフリカ、トルコ、サウジアラビア、UAE等）市場規模データ、主な企業情報と企業別市場シェア等が収録されています。 ・調査範囲 ・エグゼクティブサマリー ・企業別電子ボードレベルアンダーフィル・カプセル化材料の競争状況、市場シェア ・世界の電子ボードレベルアンダーフィル・カプセル化材料市場：種類別市場規模 2015年-2020年（フローアンダーフィルなし、キャピラリーアンダーフィル、成形アンダーフィル、ウェーハレベルアンダーフィル） ・世界の電子ボードレベルアンダーフィル・カプセル化材料市場：種類別市場規模予測 2021年-2026年（フローアンダーフィルなし、キャピラリーアンダーフィル、成形アンダーフィル、ウェーハレベルアンダーフィル） ・世界の電子ボードレベルアンダーフィル・カプセル化材料市場：用途別市場規模 2015年-2020年（半導体電子機器、航空・航空宇宙、医療機器、その他） ・世界の電子ボードレベルアンダーフィル・カプセル化材料市場：用途別市場規模予測 2021年-2026年（半導体電子機器、航空・航空宇宙、医療機器、その他） ・北米の電子ボードレベルアンダーフィル・カプセル化材料市場分析：米国、カナダ ・ヨーロッパの電子ボードレベルアンダーフィル・カプセル化材料市場分析：ドイツ、フランス、イギリス、イタリア、ロシア等 ・アジアの電子ボードレベルアンダーフィル・カプセル化材料市場分析：日本、中国、韓国、インド、オーストラリア、台湾等 ・中南米の電子ボードレベルアンダーフィル・カプセル化材料市場分析：メキシコ、ブラジル、アルゼンチン等 ・中東・アフリカの電子ボードレベルアンダーフィル・カプセル化材料市場分析：トルコ、サウジアラビア、UAE等 ・企業情報（企業概要、製品概要、販売量、企業動向） - 掲載企業（変更可能性あり）：Fuller、Masterbond、Zymet、Namics、Epoxy Technology、Yincae Advanced Materials、Henkel ・地域別市場規模予測（2021年-2026年）：北米市場、ヨーロッパ市場、アジア市場、中南米市場、中東・アフリカ市場 ・市場機会、課題、リスク、環境分析 ・バリューチェーン、販売チャネル分析 ・調査の結論 |
Underfill and encapsulation is a process of filling cavities between chip and substrate with thermoset encapsulates which protects the solders during service.
Use of Underfill and encapsulation material for Wafer level and flip chip Underfill is increasing due to accelerating demand of tablets and smart phones.
Market Analysis and Insights: Global Electronic Board Level Underfill and Encapsulation Material Market
The global Electronic Board Level Underfill and Encapsulation Material market size is projected to reach US$ XX million by 2026, from US$ XX million in 2020, at a CAGR of XX%% during 2021-2026.
Global Electronic Board Level Underfill and Encapsulation Material Scope and Market Size
Electronic Board Level Underfill and Encapsulation Material market is segmented by Type, and by Application. Players, stakeholders, and other participants in the global Electronic Board Level Underfill and Encapsulation Material market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by Type and by Application for the period 2015-2026.
Segment by Type, the Electronic Board Level Underfill and Encapsulation Material market is segmented into
No Flow Underfill
Capillary Underfill
Molded Underfill
Wafer level Underfill
Segment by Application, the Electronic Board Level Underfill and Encapsulation Material market is segmented into
Semiconductor Electronics Device
Aviation & Aerospace
Medical Devices
Others
Regional and Country-level Analysis
The Electronic Board Level Underfill and Encapsulation Material market is analysed and market size information is provided by regions (countries).
The key regions covered in the Electronic Board Level Underfill and Encapsulation Material market report are North America, Europe, Asia Pacific, Latin America, Middle East and Africa. It also covers key regions (countries), viz, U.S., Canada, Germany, France, U.K., Italy, Russia, China, Japan, South Korea, India, Australia, Taiwan, Indonesia, Thailand, Malaysia, Philippines, Vietnam, Mexico, Brazil, Turkey, Saudi Arabia, U.A.E, etc.
The report includes country-wise and region-wise market size for the period 2015-2026. It also includes market size and forecast by Type, and by Application segment in terms of sales and revenue for the period 2015-2026.
Competitive Landscape and Electronic Board Level Underfill and Encapsulation Material Market Share Analysis
Electronic Board Level Underfill and Encapsulation Material market competitive landscape provides details and data information by players. The report offers comprehensive analysis and accurate statistics on revenue by the player for the period 2015-2020. It also offers detailed analysis supported by reliable statistics on revenue (global and regional level) by players for the period 2015-2020. Details included are company description, major business, company total revenue and the sales, revenue generated in Electronic Board Level Underfill and Encapsulation Material business, the date to enter into the Electronic Board Level Underfill and Encapsulation Material market, Electronic Board Level Underfill and Encapsulation Material product introduction, recent developments, etc.
The major vendors covered:
Fuller
Masterbond
Zymet
Namics
Epoxy Technology
Yincae Advanced Materials
Henkel
…
1 Study Coverage
1.1 Electronic Board Level Underfill and Encapsulation Material Product Introduction
1.2 Market Segments
1.3 Key Electronic Board Level Underfill and Encapsulation Material Manufacturers Covered: Ranking by Revenue
1.4 Market by Type
1.4.1 Global Electronic Board Level Underfill and Encapsulation Material Market Size Growth Rate by Type
1.4.2 No Flow Underfill
1.4.3 Capillary Underfill
1.4.4 Molded Underfill
1.4.5 Wafer level Underfill
1.5 Market by Application
1.5.1 Global Electronic Board Level Underfill and Encapsulation Material Market Size Growth Rate by Application
1.5.2 Semiconductor Electronics Device
1.5.3 Aviation & Aerospace
1.5.4 Medical Devices
1.5.5 Others
1.6 Study Objectives
1.7 Years Considered
2 Executive Summary
2.1 Global Electronic Board Level Underfill and Encapsulation Material Market Size, Estimates and Forecasts
2.1.1 Global Electronic Board Level Underfill and Encapsulation Material Revenue 2015-2026
2.1.2 Global Electronic Board Level Underfill and Encapsulation Material Sales 2015-2026
2.2 Global Electronic Board Level Underfill and Encapsulation Material, Market Size by Producing Regions: 2015 VS 2020 VS 2026
2.2.1 Global Electronic Board Level Underfill and Encapsulation Material Retrospective Market Scenario in Sales by Region: 2015-2020
2.2.2 Global Electronic Board Level Underfill and Encapsulation Material Retrospective Market Scenario in Revenue by Region: 2015-2020
3 Global Electronic Board Level Underfill and Encapsulation Material Competitor Landscape by Players
3.1 Electronic Board Level Underfill and Encapsulation Material Sales by Manufacturers
3.1.1 Electronic Board Level Underfill and Encapsulation Material Sales by Manufacturers (2015-2020)
3.1.2 Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Manufacturers (2015-2020)
3.2 Electronic Board Level Underfill and Encapsulation Material Revenue by Manufacturers
3.2.1 Electronic Board Level Underfill and Encapsulation Material Revenue by Manufacturers (2015-2020)
3.2.2 Electronic Board Level Underfill and Encapsulation Material Revenue Share by Manufacturers (2015-2020)
3.2.3 Global Electronic Board Level Underfill and Encapsulation Material Market Concentration Ratio (CR5 and HHI) (2015-2020)
3.2.4 Global Top 10 and Top 5 Companies by Electronic Board Level Underfill and Encapsulation Material Revenue in 2019
3.2.5 Global Electronic Board Level Underfill and Encapsulation Material Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
3.3 Electronic Board Level Underfill and Encapsulation Material Price by Manufacturers
3.4 Electronic Board Level Underfill and Encapsulation Material Manufacturing Base Distribution, Product Types
3.4.1 Electronic Board Level Underfill and Encapsulation Material Manufacturers Manufacturing Base Distribution, Headquarters
3.4.2 Manufacturers Electronic Board Level Underfill and Encapsulation Material Product Type
3.4.3 Date of International Manufacturers Enter into Electronic Board Level Underfill and Encapsulation Material Market
3.5 Manufacturers Mergers & Acquisitions, Expansion Plans
4 Market Size by Type (2015-2026)
4.1 Global Electronic Board Level Underfill and Encapsulation Material Market Size by Type (2015-2020)
4.1.1 Global Electronic Board Level Underfill and Encapsulation Material Sales by Type (2015-2020)
4.1.2 Global Electronic Board Level Underfill and Encapsulation Material Revenue by Type (2015-2020)
4.1.3 Electronic Board Level Underfill and Encapsulation Material Average Selling Price (ASP) by Type (2015-2026)
4.2 Global Electronic Board Level Underfill and Encapsulation Material Market Size Forecast by Type (2021-2026)
4.2.1 Global Electronic Board Level Underfill and Encapsulation Material Sales Forecast by Type (2021-2026)
4.2.2 Global Electronic Board Level Underfill and Encapsulation Material Revenue Forecast by Type (2021-2026)
4.2.3 Electronic Board Level Underfill and Encapsulation Material Average Selling Price (ASP) Forecast by Type (2021-2026)
4.3 Global Electronic Board Level Underfill and Encapsulation Material Market Share by Price Tier (2015-2020): Low-End, Mid-Range and High-End
5 Market Size by Application (2015-2026)
5.1 Global Electronic Board Level Underfill and Encapsulation Material Market Size by Application (2015-2020)
5.1.1 Global Electronic Board Level Underfill and Encapsulation Material Sales by Application (2015-2020)
5.1.2 Global Electronic Board Level Underfill and Encapsulation Material Revenue by Application (2015-2020)
5.1.3 Electronic Board Level Underfill and Encapsulation Material Price by Application (2015-2020)
5.2 Electronic Board Level Underfill and Encapsulation Material Market Size Forecast by Application (2021-2026)
5.2.1 Global Electronic Board Level Underfill and Encapsulation Material Sales Forecast by Application (2021-2026)
5.2.2 Global Electronic Board Level Underfill and Encapsulation Material Revenue Forecast by Application (2021-2026)
5.2.3 Global Electronic Board Level Underfill and Encapsulation Material Price Forecast by Application (2021-2026)
6 North America
6.1 North America Electronic Board Level Underfill and Encapsulation Material by Country
6.1.1 North America Electronic Board Level Underfill and Encapsulation Material Sales by Country
6.1.2 North America Electronic Board Level Underfill and Encapsulation Material Revenue by Country
6.1.3 U.S.
6.1.4 Canada
6.2 North America Electronic Board Level Underfill and Encapsulation Material Market Facts & Figures by Type
6.3 North America Electronic Board Level Underfill and Encapsulation Material Market Facts & Figures by Application
7 Europe
7.1 Europe Electronic Board Level Underfill and Encapsulation Material by Country
7.1.1 Europe Electronic Board Level Underfill and Encapsulation Material Sales by Country
7.1.2 Europe Electronic Board Level Underfill and Encapsulation Material Revenue by Country
7.1.3 Germany
7.1.4 France
7.1.5 U.K.
7.1.6 Italy
7.1.7 Russia
7.2 Europe Electronic Board Level Underfill and Encapsulation Material Market Facts & Figures by Type
7.3 Europe Electronic Board Level Underfill and Encapsulation Material Market Facts & Figures by Application
8 Asia Pacific
8.1 Asia Pacific Electronic Board Level Underfill and Encapsulation Material by Region
8.1.1 Asia Pacific Electronic Board Level Underfill and Encapsulation Material Sales by Region
8.1.2 Asia Pacific Electronic Board Level Underfill and Encapsulation Material Revenue by Region
8.1.3 China
8.1.4 Japan
8.1.5 South Korea
8.1.6 India
8.1.7 Australia
8.1.8 Taiwan
8.1.9 Indonesia
8.1.10 Thailand
8.1.11 Malaysia
8.1.12 Philippines
8.1.13 Vietnam
8.2 Asia Pacific Electronic Board Level Underfill and Encapsulation Material Market Facts & Figures by Type
8.3 Asia Pacific Electronic Board Level Underfill and Encapsulation Material Market Facts & Figures by Application
9 Latin America
9.1 Latin America Electronic Board Level Underfill and Encapsulation Material by Country
9.1.1 Latin America Electronic Board Level Underfill and Encapsulation Material Sales by Country
9.1.2 Latin America Electronic Board Level Underfill and Encapsulation Material Revenue by Country
9.1.3 Mexico
9.1.4 Brazil
9.1.5 Argentina
9.2 Central & South America Electronic Board Level Underfill and Encapsulation Material Market Facts & Figures by Type
9.3 Central & South America Electronic Board Level Underfill and Encapsulation Material Market Facts & Figures by Application
10 Middle East and Africa
10.1 Middle East and Africa Electronic Board Level Underfill and Encapsulation Material by Country
10.1.1 Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Sales by Country
10.1.2 Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Revenue by Country
10.1.3 Turkey
10.1.4 Saudi Arabia
10.1.5 U.A.E
10.2 Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Market Facts & Figures by Type
10.3 Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Market Facts & Figures by Application
11 Company Profiles
11.1 Fuller
11.1.1 Fuller Corporation Information
11.1.2 Fuller Description and Business Overview
11.1.3 Fuller Sales, Revenue and Gross Margin (2015-2020)
11.1.4 Fuller Electronic Board Level Underfill and Encapsulation Material Products Offered
11.1.5 Fuller Related Developments
11.2 Masterbond
11.2.1 Masterbond Corporation Information
11.2.2 Masterbond Description and Business Overview
11.2.3 Masterbond Sales, Revenue and Gross Margin (2015-2020)
11.2.4 Masterbond Electronic Board Level Underfill and Encapsulation Material Products Offered
11.2.5 Masterbond Related Developments
11.3 Zymet
11.3.1 Zymet Corporation Information
11.3.2 Zymet Description and Business Overview
11.3.3 Zymet Sales, Revenue and Gross Margin (2015-2020)
11.3.4 Zymet Electronic Board Level Underfill and Encapsulation Material Products Offered
11.3.5 Zymet Related Developments
11.4 Namics
11.4.1 Namics Corporation Information
11.4.2 Namics Description and Business Overview
11.4.3 Namics Sales, Revenue and Gross Margin (2015-2020)
11.4.4 Namics Electronic Board Level Underfill and Encapsulation Material Products Offered
11.4.5 Namics Related Developments
11.5 Epoxy Technology
11.5.1 Epoxy Technology Corporation Information
11.5.2 Epoxy Technology Description and Business Overview
11.5.3 Epoxy Technology Sales, Revenue and Gross Margin (2015-2020)
11.5.4 Epoxy Technology Electronic Board Level Underfill and Encapsulation Material Products Offered
11.5.5 Epoxy Technology Related Developments
11.6 Yincae Advanced Materials
11.6.1 Yincae Advanced Materials Corporation Information
11.6.2 Yincae Advanced Materials Description and Business Overview
11.6.3 Yincae Advanced Materials Sales, Revenue and Gross Margin (2015-2020)
11.6.4 Yincae Advanced Materials Electronic Board Level Underfill and Encapsulation Material Products Offered
11.6.5 Yincae Advanced Materials Related Developments
11.7 Henkel
11.7.1 Henkel Corporation Information
11.7.2 Henkel Description and Business Overview
11.7.3 Henkel Sales, Revenue and Gross Margin (2015-2020)
11.7.4 Henkel Electronic Board Level Underfill and Encapsulation Material Products Offered
11.7.5 Henkel Related Developments
11.1 Fuller
11.1.1 Fuller Corporation Information
11.1.2 Fuller Description and Business Overview
11.1.3 Fuller Sales, Revenue and Gross Margin (2015-2020)
11.1.4 Fuller Electronic Board Level Underfill and Encapsulation Material Products Offered
11.1.5 Fuller Related Developments
12 Future Forecast by Regions (Countries) (2021-2026)
12.1 Electronic Board Level Underfill and Encapsulation Material Market Estimates and Projections by Region
12.1.1 Global Electronic Board Level Underfill and Encapsulation Material Sales Forecast by Regions 2021-2026
12.1.2 Global Electronic Board Level Underfill and Encapsulation Material Revenue Forecast by Regions 2021-2026
12.2 North America Electronic Board Level Underfill and Encapsulation Material Market Size Forecast (2021-2026)
12.2.1 North America: Electronic Board Level Underfill and Encapsulation Material Sales Forecast (2021-2026)
12.2.2 North America: Electronic Board Level Underfill and Encapsulation Material Revenue Forecast (2021-2026)
12.2.3 North America: Electronic Board Level Underfill and Encapsulation Material Market Size Forecast by Country (2021-2026)
12.3 Europe Electronic Board Level Underfill and Encapsulation Material Market Size Forecast (2021-2026)
12.3.1 Europe: Electronic Board Level Underfill and Encapsulation Material Sales Forecast (2021-2026)
12.3.2 Europe: Electronic Board Level Underfill and Encapsulation Material Revenue Forecast (2021-2026)
12.3.3 Europe: Electronic Board Level Underfill and Encapsulation Material Market Size Forecast by Country (2021-2026)
12.4 Asia Pacific Electronic Board Level Underfill and Encapsulation Material Market Size Forecast (2021-2026)
12.4.1 Asia Pacific: Electronic Board Level Underfill and Encapsulation Material Sales Forecast (2021-2026)
12.4.2 Asia Pacific: Electronic Board Level Underfill and Encapsulation Material Revenue Forecast (2021-2026)
12.4.3 Asia Pacific: Electronic Board Level Underfill and Encapsulation Material Market Size Forecast by Region (2021-2026)
12.5 Latin America Electronic Board Level Underfill and Encapsulation Material Market Size Forecast (2021-2026)
12.5.1 Latin America: Electronic Board Level Underfill and Encapsulation Material Sales Forecast (2021-2026)
12.5.2 Latin America: Electronic Board Level Underfill and Encapsulation Material Revenue Forecast (2021-2026)
12.5.3 Latin America: Electronic Board Level Underfill and Encapsulation Material Market Size Forecast by Country (2021-2026)
12.6 Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Market Size Forecast (2021-2026)
12.6.1 Middle East and Africa: Electronic Board Level Underfill and Encapsulation Material Sales Forecast (2021-2026)
12.6.2 Middle East and Africa: Electronic Board Level Underfill and Encapsulation Material Revenue Forecast (2021-2026)
12.6.3 Middle East and Africa: Electronic Board Level Underfill and Encapsulation Material Market Size Forecast by Country (2021-2026)
13 Market Opportunities, Challenges, Risks and Influences Factors Analysis
13.1 Market Opportunities and Drivers
13.2 Market Challenges
13.3 Market Risks/Restraints
13.4 Porter’s Five Forces Analysis
13.5 Primary Interviews with Key Electronic Board Level Underfill and Encapsulation Material Players (Opinion Leaders)
14 Value Chain and Sales Channels Analysis
14.1 Value Chain Analysis
14.2 Electronic Board Level Underfill and Encapsulation Material Customers
14.3 Sales Channels Analysis
14.3.1 Sales Channels
14.3.2 Distributors
15 Research Findings and Conclusion
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer
Table 1. Electronic Board Level Underfill and Encapsulation Material Market Segments
Table 2. Ranking of Global Top Electronic Board Level Underfill and Encapsulation Material Manufacturers by Revenue (US$ Million) in 2019
Table 3. Global Electronic Board Level Underfill and Encapsulation Material Market Size Growth Rate by Type 2020-2026 (K MT) & (US$ Million)
Table 4. Major Manufacturers of No Flow Underfill
Table 5. Major Manufacturers of Capillary Underfill
Table 6. Major Manufacturers of Molded Underfill
Table 7. Major Manufacturers of Wafer level Underfill
Table 8. Global Electronic Board Level Underfill and Encapsulation Material Market Size Growth Rate by Application 2020-2026 (K MT)
Table 9. Global Electronic Board Level Underfill and Encapsulation Material Market Size by Region (K MT) & (US$ Million): 2020 VS 2026
Table 10. Global Electronic Board Level Underfill and Encapsulation Material Sales by Regions 2015-2020 (K MT)
Table 11. Global Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Regions (2015-2020)
Table 12. Global Electronic Board Level Underfill and Encapsulation Material Revenue by Regions 2015-2020 (US$ Million)
Table 13. Global Electronic Board Level Underfill and Encapsulation Material Sales by Manufacturers (2015-2020) (K MT)
Table 14. Global Electronic Board Level Underfill and Encapsulation Material Sales Share by Manufacturers (2015-2020)
Table 15. Global Electronic Board Level Underfill and Encapsulation Material Manufacturers Market Concentration Ratio (CR5 and HHI) (2015-2020)
Table 16. Global Electronic Board Level Underfill and Encapsulation Material by Company Type (Tier 1, Tier 2 and Tier 3) (based on the Revenue in Electronic Board Level Underfill and Encapsulation Material as of 2019)
Table 17. Electronic Board Level Underfill and Encapsulation Material Revenue by Manufacturers (2015-2020) (US$ Million)
Table 18. Electronic Board Level Underfill and Encapsulation Material Revenue Share by Manufacturers (2015-2020)
Table 19. Key Manufacturers Electronic Board Level Underfill and Encapsulation Material Price (2015-2020) (USD/MT)
Table 20. Electronic Board Level Underfill and Encapsulation Material Manufacturers Manufacturing Base Distribution and Headquarters
Table 21. Manufacturers Electronic Board Level Underfill and Encapsulation Material Product Type
Table 22. Date of International Manufacturers Enter into Electronic Board Level Underfill and Encapsulation Material Market
Table 23. Manufacturers Mergers & Acquisitions, Expansion Plans
Table 24. Global Electronic Board Level Underfill and Encapsulation Material Sales by Type (2015-2020) (K MT)
Table 25. Global Electronic Board Level Underfill and Encapsulation Material Sales Share by Type (2015-2020)
Table 26. Global Electronic Board Level Underfill and Encapsulation Material Revenue by Type (2015-2020) (US$ Million)
Table 27. Global Electronic Board Level Underfill and Encapsulation Material Revenue Share by Type (2015-2020)
Table 28. Electronic Board Level Underfill and Encapsulation Material Average Selling Price (ASP) by Type 2015-2020 (USD/MT)
Table 29. Global Electronic Board Level Underfill and Encapsulation Material Sales by Application (2015-2020) (K MT)
Table 30. Global Electronic Board Level Underfill and Encapsulation Material Sales Share by Application (2015-2020)
Table 31. North America Electronic Board Level Underfill and Encapsulation Material Sales by Country (2015-2020) (K MT)
Table 32. North America Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Country (2015-2020)
Table 33. North America Electronic Board Level Underfill and Encapsulation Material Revenue by Country (2015-2020) (US$ Million)
Table 34. North America Electronic Board Level Underfill and Encapsulation Material Revenue Market Share by Country (2015-2020)
Table 35. North America Electronic Board Level Underfill and Encapsulation Material Sales by Type (2015-2020) (K MT)
Table 36. North America Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Type (2015-2020)
Table 37. North America Electronic Board Level Underfill and Encapsulation Material Sales by Application (2015-2020) (K MT)
Table 38. North America Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Application (2015-2020)
Table 39. Europe Electronic Board Level Underfill and Encapsulation Material Sales by Country (2015-2020) (K MT)
Table 40. Europe Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Country (2015-2020)
Table 41. Europe Electronic Board Level Underfill and Encapsulation Material Revenue by Country (2015-2020) (US$ Million)
Table 42. Europe Electronic Board Level Underfill and Encapsulation Material Revenue Market Share by Country (2015-2020)
Table 43. Europe Electronic Board Level Underfill and Encapsulation Material Sales by Type (2015-2020) (K MT)
Table 44. Europe Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Type (2015-2020)
Table 45. Europe Electronic Board Level Underfill and Encapsulation Material Sales by Application (2015-2020) (K MT)
Table 46. Europe Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Application (2015-2020)
Table 47. Asia Pacific Electronic Board Level Underfill and Encapsulation Material Sales by Region (2015-2020) (K MT)
Table 48. Asia Pacific Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Region (2015-2020)
Table 49. Asia Pacific Electronic Board Level Underfill and Encapsulation Material Revenue by Region (2015-2020) (US$ Million)
Table 50. Asia Pacific Electronic Board Level Underfill and Encapsulation Material Revenue Market Share by Region (2015-2020)
Table 51. Asia Pacific Electronic Board Level Underfill and Encapsulation Material Sales by Type (2015-2020) (K MT)
Table 52. Asia Pacific Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Type (2015-2020)
Table 53. Asia Pacific Electronic Board Level Underfill and Encapsulation Material Sales by Application (2015-2020) (K MT)
Table 54. Asia Pacific Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Application (2015-2020)
Table 55. Latin America Electronic Board Level Underfill and Encapsulation Material Sales by Country (2015-2020) (K MT)
Table 56. Latin America Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Country (2015-2020)
Table 57. Latin Americaa Electronic Board Level Underfill and Encapsulation Material Revenue by Country (2015-2020) (US$ Million)
Table 58. Latin America Electronic Board Level Underfill and Encapsulation Material Revenue Market Share by Country (2015-2020)
Table 59. Latin America Electronic Board Level Underfill and Encapsulation Material Sales by Type (2015-2020) (K MT)
Table 60. Latin America Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Type (2015-2020)
Table 61. Latin America Electronic Board Level Underfill and Encapsulation Material Sales by Application (2015-2020) (K MT)
Table 62. Latin America Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Application (2015-2020)
Table 63. Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Sales by Country (2015-2020) (K MT)
Table 64. Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Country (2015-2020)
Table 65. Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Revenue by Country (2015-2020) (US$ Million)
Table 66. Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Revenue Market Share by Country (2015-2020)
Table 67. Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Sales by Type (2015-2020) (K MT)
Table 68. Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Type (2015-2020)
Table 69. Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Sales by Application (2015-2020) (K MT)
Table 70. Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Application (2015-2020)
Table 71. Fuller Corporation Information
Table 72. Fuller Description and Major Businesses
Table 73. Fuller Electronic Board Level Underfill and Encapsulation Material Production (K MT), Revenue (US$ Million), Price (USD/MT) and Gross Margin (2015-2020)
Table 74. Fuller Product
Table 75. Fuller Recent Development
Table 76. Masterbond Corporation Information
Table 77. Masterbond Description and Major Businesses
Table 78. Masterbond Electronic Board Level Underfill and Encapsulation Material Production (K MT), Revenue (US$ Million), Price (USD/MT) and Gross Margin (2015-2020)
Table 79. Masterbond Product
Table 80. Masterbond Recent Development
Table 81. Zymet Corporation Information
Table 82. Zymet Description and Major Businesses
Table 83. Zymet Electronic Board Level Underfill and Encapsulation Material Production (K MT), Revenue (US$ Million), Price (USD/MT) and Gross Margin (2015-2020)
Table 84. Zymet Product
Table 85. Zymet Recent Development
Table 86. Namics Corporation Information
Table 87. Namics Description and Major Businesses
Table 88. Namics Electronic Board Level Underfill and Encapsulation Material Production (K MT), Revenue (US$ Million), Price (USD/MT) and Gross Margin (2015-2020)
Table 89. Namics Product
Table 90. Namics Recent Development
Table 91. Epoxy Technology Corporation Information
Table 92. Epoxy Technology Description and Major Businesses
Table 93. Epoxy Technology Electronic Board Level Underfill and Encapsulation Material Production (K MT), Revenue (US$ Million), Price (USD/MT) and Gross Margin (2015-2020)
Table 94. Epoxy Technology Product
Table 95. Epoxy Technology Recent Development
Table 96. Yincae Advanced Materials Corporation Information
Table 97. Yincae Advanced Materials Description and Major Businesses
Table 98. Yincae Advanced Materials Electronic Board Level Underfill and Encapsulation Material Production (K MT), Revenue (US$ Million), Price (USD/MT) and Gross Margin (2015-2020)
Table 99. Yincae Advanced Materials Product
Table 100. Yincae Advanced Materials Recent Development
Table 101. Henkel Corporation Information
Table 102. Henkel Description and Major Businesses
Table 103. Henkel Electronic Board Level Underfill and Encapsulation Material Production (K MT), Revenue (US$ Million), Price (USD/MT) and Gross Margin (2015-2020)
Table 104. Henkel Product
Table 105. Henkel Recent Development
Table 106. Global Electronic Board Level Underfill and Encapsulation Material Sales Forecast by Regions (2021-2026) (K MT)
Table 107. Global Electronic Board Level Underfill and Encapsulation Material Sales Market Share Forecast by Regions (2021-2026)
Table 108. Global Electronic Board Level Underfill and Encapsulation Material Revenue Forecast by Regions (2021-2026) (US$ Million)
Table 109. Global Electronic Board Level Underfill and Encapsulation Material Revenue Market Share Forecast by Regions (2021-2026)
Table 110. North America: Electronic Board Level Underfill and Encapsulation Material Sales Forecast by Country (2021-2026) (K MT)
Table 111. North America: Electronic Board Level Underfill and Encapsulation Material Revenue Forecast by Country (2021-2026) (US$ Million)
Table 112. Europe: Electronic Board Level Underfill and Encapsulation Material Sales Forecast by Country (2021-2026) (K MT)
Table 113. Europe: Electronic Board Level Underfill and Encapsulation Material Revenue Forecast by Country (2021-2026) (US$ Million)
Table 114. Asia Pacific: Electronic Board Level Underfill and Encapsulation Material Sales Forecast by Region (2021-2026) (K MT)
Table 115. Asia Pacific: Electronic Board Level Underfill and Encapsulation Material Revenue Forecast by Region (2021-2026) (US$ Million)
Table 116. Latin America: Electronic Board Level Underfill and Encapsulation Material Sales Forecast by Country (2021-2026) (K MT)
Table 117. Latin America: Electronic Board Level Underfill and Encapsulation Material Revenue Forecast by Country (2021-2026) (US$ Million)
Table 118. Middle East and Africa: Electronic Board Level Underfill and Encapsulation Material Sales Forecast by Country (2021-2026) (K MT)
Table 119. Middle East and Africa: Electronic Board Level Underfill and Encapsulation Material Revenue Forecast by Country (2021-2026) (US$ Million)
Table 120. Key Opportunities and Drivers: Impact Analysis (2021-2026)
Table 121. Key Challenges
Table 122. Market Risks
Table 123. Main Points Interviewed from Key Electronic Board Level Underfill and Encapsulation Material Players
Table 124. Electronic Board Level Underfill and Encapsulation Material Customers List
Table 125. Electronic Board Level Underfill and Encapsulation Material Distributors List
Table 126. Research Programs/Design for This Report
Table 127. Key Data Information from Secondary Sources
Table 128. Key Data Information from Primary Sources
List of Figures
Figure 1. Electronic Board Level Underfill and Encapsulation Material Product Picture
Figure 2. Global Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Type in 2020 & 2026
Figure 3. No Flow Underfill Product Picture
Figure 4. Capillary Underfill Product Picture
Figure 5. Molded Underfill Product Picture
Figure 6. Wafer level Underfill Product Picture
Figure 7. Global Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Application in 2020 & 2026
Figure 8. Semiconductor Electronics Device
Figure 9. Aviation & Aerospace
Figure 10. Medical Devices
Figure 11. Others
Figure 12. Electronic Board Level Underfill and Encapsulation Material Report Years Considered
Figure 13. Global Electronic Board Level Underfill and Encapsulation Material Market Size 2015-2026 (US$ Million)
Figure 14. Global Electronic Board Level Underfill and Encapsulation Material Sales 2015-2026 (K MT)
Figure 15. Global Electronic Board Level Underfill and Encapsulation Material Market Size Market Share by Region: 2020 Versus 2026
Figure 16. Global Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Region (2015-2020)
Figure 17. Global Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Region in 2019
Figure 18. Global Electronic Board Level Underfill and Encapsulation Material Revenue Market Share by Region (2015-2020)
Figure 19. Global Electronic Board Level Underfill and Encapsulation Material Revenue Market Share by Region in 2019
Figure 20. Global Electronic Board Level Underfill and Encapsulation Material Sales Share by Manufacturer in 2019
Figure 21. The Top 10 and 5 Players Market Share by Electronic Board Level Underfill and Encapsulation Material Revenue in 2019
Figure 22. Electronic Board Level Underfill and Encapsulation Material Market Share by Company Type (Tier 1, Tier 2 and Tier 3): 2015 VS 2019
Figure 23. Global Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Type (2015-2020)
Figure 24. Global Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Type in 2019
Figure 25. Global Electronic Board Level Underfill and Encapsulation Material Revenue Market Share by Type (2015-2020)
Figure 26. Global Electronic Board Level Underfill and Encapsulation Material Revenue Market Share by Type in 2019
Figure 27. Global Electronic Board Level Underfill and Encapsulation Material Market Share by Price Range (2015-2020)
Figure 28. Global Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Application (2015-2020)
Figure 29. Global Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Application in 2019
Figure 30. Global Electronic Board Level Underfill and Encapsulation Material Revenue Market Share by Application (2015-2020)
Figure 31. Global Electronic Board Level Underfill and Encapsulation Material Revenue Market Share by Application in 2019
Figure 32. North America Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate 2015-2020 (K MT)
Figure 33. North America Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate 2015-2020 (US$ Million)
Figure 34. North America Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Country in 2019
Figure 35. North America Electronic Board Level Underfill and Encapsulation Material Revenue Market Share by Country in 2019
Figure 36. U.S. Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate (2015-2020) (K MT)
Figure 37. U.S. Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate (2015-2020) (US$ Million)
Figure 38. Canada Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate (2015-2020) (K MT)
Figure 39. Canada Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate (2015-2020) (US$ Million)
Figure 40. North America Electronic Board Level Underfill and Encapsulation Material Market Share by Type in 2019
Figure 41. North America Electronic Board Level Underfill and Encapsulation Material Market Share by Application in 2019
Figure 42. Europe Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate 2015-2020 (K MT)
Figure 43. Europe Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate 2015-2020 (US$ Million)
Figure 44. Europe Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Country in 2019
Figure 45. Europe Electronic Board Level Underfill and Encapsulation Material Revenue Market Share by Country in 2019
Figure 46. Germany Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate (2015-2020) (K MT)
Figure 47. Germany Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate (2015-2020) (US$ Million)
Figure 48. France Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate (2015-2020) (K MT)
Figure 49. France Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate (2015-2020) (US$ Million)
Figure 50. U.K. Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate (2015-2020) (K MT)
Figure 51. U.K. Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate (2015-2020) (US$ Million)
Figure 52. Italy Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate (2015-2020) (K MT)
Figure 53. Italy Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate (2015-2020) (US$ Million)
Figure 54. Russia Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate (2015-2020) (K MT)
Figure 55. Russia Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate (2015-2020) (US$ Million)
Figure 56. Europe Electronic Board Level Underfill and Encapsulation Material Market Share by Type in 2019
Figure 57. Europe Electronic Board Level Underfill and Encapsulation Material Market Share by Application in 2019
Figure 58. Asia Pacific Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate 2015-2020 (K MT)
Figure 59. Asia Pacific Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate 2015-2020 (US$ Million)
Figure 60. Asia Pacific Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Region in 2019
Figure 61. Asia Pacific Electronic Board Level Underfill and Encapsulation Material Revenue Market Share by Region in 2019
Figure 62. China Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate (2015-2020) (K MT)
Figure 63. China Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate (2015-2020) (US$ Million)
Figure 64. Japan Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate (2015-2020) (K MT)
Figure 65. Japan Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate (2015-2020) (US$ Million)
Figure 66. South Korea Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate (2015-2020) (K MT)
Figure 67. South Korea Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate (2015-2020) (US$ Million)
Figure 68. India Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate (2015-2020) (K MT)
Figure 69. India Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate (2015-2020) (US$ Million)
Figure 70. Australia Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate (2015-2020) (K MT)
Figure 71. Australia Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate (2015-2020) (US$ Million)
Figure 72. Taiwan Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate (2015-2020) (K MT)
Figure 73. Taiwan Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate (2015-2020) (US$ Million)
Figure 74. Indonesia Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate (2015-2020) (K MT)
Figure 75. Indonesia Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate (2015-2020) (US$ Million)
Figure 76. Thailand Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate (2015-2020) (K MT)
Figure 77. Thailand Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate (2015-2020) (US$ Million)
Figure 78. Malaysia Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate (2015-2020) (K MT)
Figure 79. Malaysia Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate (2015-2020) (US$ Million)
Figure 80. Philippines Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate (2015-2020) (K MT)
Figure 81. Philippines Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate (2015-2020) (US$ Million)
Figure 82. Vietnam Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate (2015-2020) (K MT)
Figure 83. Vietnam Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate (2015-2020) (US$ Million)
Figure 84. Asia Pacific Electronic Board Level Underfill and Encapsulation Material Market Share by Type in 2019
Figure 85. Asia Pacific Electronic Board Level Underfill and Encapsulation Material Market Share by Application in 2019
Figure 86. Latin America Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate 2015-2020 (K MT)
Figure 87. Latin America Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate 2015-2020 (US$ Million)
Figure 88. Latin America Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Country in 2019
Figure 89. Latin America Electronic Board Level Underfill and Encapsulation Material Revenue Market Share by Country in 2019
Figure 90. Mexico Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate (2015-2020) (K MT)
Figure 91. Mexico Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate (2015-2020) (US$ Million)
Figure 92. Brazil Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate (2015-2020) (K MT)
Figure 93. Brazil Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate (2015-2020) (US$ Million)
Figure 94. Argentina Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate (2015-2020) (K MT)
Figure 95. Argentina Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate (2015-2020) (US$ Million)
Figure 96. Latin America Electronic Board Level Underfill and Encapsulation Material Market Share by Type in 2019
Figure 97. Latin America Electronic Board Level Underfill and Encapsulation Material Market Share by Application in 2019
Figure 98. Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate 2015-2020 (K MT)
Figure 99. Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate 2015-2020 (US$ Million)
Figure 100. Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Sales Market Share by Country in 2019
Figure 101. Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Revenue Market Share by Country in 2019
Figure 102. Turkey Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate (2015-2020) (K MT)
Figure 103. Turkey Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate (2015-2020) (US$ Million)
Figure 104. Saudi Arabia Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate (2015-2020) (K MT)
Figure 105. Saudi Arabia Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate (2015-2020) (US$ Million)
Figure 106. U.A.E Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate (2015-2020) (K MT)
Figure 107. U.A.E Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate (2015-2020) (US$ Million)
Figure 108. Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Market Share by Type in 2019
Figure 109. Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Market Share by Application in 2019
Figure 110. North America Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate Forecast (2021-2026) (K MT)
Figure 111. North America Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate Forecast (2021-2026) (US$ Million)
Figure 112. Europe Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate Forecast (2021-2026) (K MT)
Figure 113. Europe Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate Forecast (2021-2026) (US$ Million)
Figure 114. Asia Pacific Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate Forecast (2021-2026) (K MT)
Figure 115. Asia Pacific Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate Forecast (2021-2026) (US$ Million)
Figure 116. Latin America Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate Forecast (2021-2026) (K MT)
Figure 117. Latin America Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate Forecast (2021-2026) (US$ Million)
Figure 118. Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Sales Growth Rate Forecast (2021-2026) (K MT)
Figure 119. Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Revenue Growth Rate Forecast (2021-2026) (US$ Million)
Figure 120. Porter's Five Forces Analysis
Figure 121. Channels of Distribution
Figure 122. Distributors Profiles
Figure 123. Bottom-up and Top-down Approaches for This Report
Figure 124. Data Triangulation
Figure 125. Key Executives Interviewed
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